Thermal Management

IDTechEx research analysis has shown that this industry, which is almost a century in the making, is finally coming of age. Major players are finding more nascent applications and new entries are progressing out of semi-commercial prototypes and into full market launches.

From the Exhibition Hall at the IDTechEx Show! in Santa Clara last week came a wide variety of new product announcements and press releases. Here we summarize some of the announcements.

The South Korean giant Samsung just got itself into dire straits as the story behind the reported battery fires related to the Galaxy Note 7 unfolds even further. As of September, 92 accidents have been reported in the US alone.

Managing temperatures using appropriate electronics packaging materials is essential to ensure the reliability of high-power LED applications.

The suitability of the proposed technology has been analysed and it was proved that lithium-ion capacitors can act as a main power or energy source without any reduction of the system capabilities.

Heat dissipation in electronics and optoelectronics is a major obstacle to further technology development. It limits further miniaturisation, power, performance and reliability.

While there are obviously similarities, different applications have different key requirements of the TIMs. In all cases, the TIM needs to minimise stress, prevent electromigration of its fillers, and maximise adhesion.

Microsoft has tested a prototype of a self-contained data center that can operate hundreds of feet below the surface of the ocean, in efforts to reducing the need for expensive air-conditioning.

Proper selection of thermal interface materials is crucial for the efficiency of electronic devices, has been proven to reduce the cost of ownership, reduce system power consumption and increase operational lifetime.

Everyone wants portable products. Miniature high density circuits, often housed in airtight enclosures are required, so we can use our devices everywhere, including in wearable technologies. Heat management is therefore a big problem, particularly as the trend of consumers demanding smaller, faster operating electronics continues.