Thermal Management

Whilst much of the "5G" infrastructure is a moderate upgrade on existing 4G technology, there is still plenty of scope for higher frequency deployment such as mmWave devices and very different station types such as small cells. Each of these new developments presents its own technological evolution and with it, thermal challenges.

IDTechEx's new report, "Thermal Management for ADAS: 2023-2033" finds that the yearly market value for thermal interface materials (TIMs) in ADAS will increase 11-fold over the next 10 years.

Haptics 2023-2033: Technologies, Markets, and Players - Current and emerging technologies (ERM motors, LRAs, piezoelectric ceramics and polymers, surface haptics, SMAs, electroactive polymers, contactless haptics and thermal haptics), markets, forecasts, and players in haptics.

Thermal Management for Advanced Driver-Assistance Systems (ADAS) 2023-2033 - Thermal management challenges, solutions, and trends for cameras, radars, LiDARs, and automotive computers. Thermal interface materials, die attach, radome materials and electromagnetic interference, analysis, players, and market forecasts

The current state of 5G has seen less technological innovation than might have initially been expected. There is certainly more scope for technical development and hence opportunities for several technologies and materials, a critical one of which is the semiconductor technology with wide bandgap semiconductors.

Charging speeds for electric vehicles (EVs) vary, from as little as 15 minutes using an ultra-rapid 350 kW charger, to as much as 24 hours when relying on a domestic wall outlet. Eventually, we could reach a point where recharging barely takes longer than filling up with fuel.

The MWC event in Barcelona earlier this month gathered more than 60,000 mobile experts from all around the world. From digital applications to network infrastructure, IDTechEx was there to cover major developments in the industry! Here are some of the key trends we observed at MWC2022 Barcelona.

Thursday 3 March 2022 - Introduction to changes in telecommunications infrastructure; Choice of semiconductor technology for sub-6 GHz and mmWave 5G; Case studies of sub-6 GHz and mmWave antenna; Overview of die attach materials and methodology; and Thermal interface materials for infrastructure and smartphone

5G deployment is in full swing with mid-band infrastructure installed by the end of 2021 representing nearly 6 times what it was in 2019. However, this doesn't mean that all of the challenges have been solved. Much of the 5G infrastructure is repurposed 4G equipment at lower frequency bands. The real transition to 5G comes from the adoption of higher frequencies which have largely been categorized into sub-6 GHz and mmWave (> 20 GHz) bands. One of the key challenges is thermal management.

The past two years have been extremely turbulent for many industries with production lines shutting down, chip shortages, and a host of general supply chain issues. Amongst the dismay, electric vehicles (EVs) have been a shining light. In 2021, sales of EVs globally grew by around 80% over 2020 which in turn was a growth of 44% over 2019.