Thermal Management

Wednesday 30 October 2024 - Data Center Liquid Cooling - 6-Fold Market Size Expansion in 10 Years; Air cooling overview; Direct-to-chip cooling: An exploration of technical barriers and advantages of single- and two-phase D2C cooling; Immersion cooling: An examination of single-phase and two-phase immersion and their technical and commercial barriers; Coolant comparison and regulations: A comparative analysis of coolants used in liquid cooling systems, including costs, regulatory requirements and operating temperature; Data center cooling value chain and liquid cooling on the data center facility level; Cost analysis of data center cooling; Thermal interface materials: An overview of the critical TIMs in efficient heat transfer within cooling systems; Market size forecast and future opportunities

The rapid rise of AI and HPC (high performing computing) applications is driving a fundamental shift in data center cooling strategies. As chips like Nvidia's B200 and Intel's Falcon Shores GPU push the limits of thermal design power, direct-to-chip and immersion cooling solutions are becoming critical to managing the heat loads in modern data centers.

As EV adoption grows, stakeholders across automotive, energy, and technology sectors are in search of detailed insights to shape their strategies and investments.

Semiconductor manufacturing processes require many chemicals and specialty gases. Owing to its cryogenic properties, exceptional thermal conductivity, chemical inertness, and high diffusivity, helium is used throughout the semiconductor manufacturing line, particularly for wafer cooling where there are no viable alternatives.

Tuesday 24 September 2024 - How Chronic Supply Challenges Are Reshaping Helium Use in Key Industries. An overview of global helium production and supply; Impact of supply challenges on different industries e.g. semiconductors and fiber optics manufacturing, cryogenics, and several others; Technological advances to reduce helium consumption (e.g. MRI and NMR); Trends in the adoption of substitutes or reclamation systems; Outlook for global helium production capacity and demand

The key to wider adoption of electric vehicles (EVs) will be lower-cost models with a more approachable price point. The most expensive component of an EV is the battery pack. As well as increasing the energy density and reducing the cost of the battery cells, another avenue to cost reduction is through more efficient packaging of the cells.

Helium is a finite resource that plays a critical role across several industries including medical imaging, thermal management systems for batteries, aerospace engineering, chemicals and pharmaceuticals, semiconductor manufacturing, fiber optics, particle physics, scientific balloons, and many more.

With the ever-increasing need for heat dissipation, high-performance thermal interface materials with higher thermal conductivity and other properties are becoming essential. Driven by this trend, a number of high-performance TIMs are emerging. This article primarily introduces the advantages and drawbacks of advanced carbon-based TIMs. However, it is worth noting that many other TIMs offer superior performance.

While the focus of the automotive market has been on electrification to meet CO2 regulations, these are not the only regulations that will significantly impact the automotive industry. PFAS are becoming a greater concern throughout multiple industries. With the uncertainty around PFAS regulations, there are a few avenues that automotive players could pursue to replace the refrigerants they use.

IDTechEx expects the printed and flexible sensor market to reach US$960 million by 2034, with a compound annual growth rate of 8.6%. Being connected to infrastructure systems or partnering with suppliers and distributors will help printed sensors take off, alongside their ability to be available at scale, robust, and have long product lifetimes.