Thermal Management

As electric vehicles (EVs) continue to reshape the automotive landscape, the integration of Vehicle-to-Grid (V2G) technology offers transformative potential for both the energy grid and vehicle owners.

Wednesday 13 November 2024 - Enabling Emerging Industries Through Thermal Management in 2024 and Beyond; Thermal management fluids and greater component integration in EVs; EV power electronics and its emerging thermal management needs; Adoption of new thermal management systems in data centers; How the above trends impact thermal interface materials and their application

As of 2024, single-phase direct-to-chip (D2C) cooling dominates the high-end GPU thermal management market. However, with the increasing thermal design power (TDP), two-phase D2C cooling will be required.

Given helium's critical role in semiconductor production, onshoring chip manufacturing will have a significant knock-on impact on the helium demand for semiconductor manufacturing.

Thursday 24 October 2024 - Strategic Roadmap for EV Charging: Market Trends, Emerging Tech, and Opportunities; Market Overview: A comprehensive analysis of global EV charging infrastructure, including public, private, and fleet solutions, and insights into key regions such as China, Europe, and the US; Emerging Technologies: Discover innovations like megawatt charging, wireless charging, battery swapping, and off-grid solar solutions that are redefining the EV charging experience; Competitive Landscape: Insights into key market players, product benchmarking, and strategic positioning, including the impact of market consolidation and V2X (Vehicle-to-Everything) solutions; Challenges and Opportunities: Explore the technical challenges of high-power charging, grid limitations, and the latest on megawatt charging standards for heavy-duty vehicles

Wednesday 30 October 2024 - Data Center Liquid Cooling - 6-Fold Market Size Expansion in 10 Years; Air cooling overview; Direct-to-chip cooling: An exploration of technical barriers and advantages of single- and two-phase D2C cooling; Immersion cooling: An examination of single-phase and two-phase immersion and their technical and commercial barriers; Coolant comparison and regulations: A comparative analysis of coolants used in liquid cooling systems, including costs, regulatory requirements and operating temperature; Data center cooling value chain and liquid cooling on the data center facility level; Cost analysis of data center cooling; Thermal interface materials: An overview of the critical TIMs in efficient heat transfer within cooling systems; Market size forecast and future opportunities

The rapid rise of AI and HPC (high performing computing) applications is driving a fundamental shift in data center cooling strategies. As chips like Nvidia's B200 and Intel's Falcon Shores GPU push the limits of thermal design power, direct-to-chip and immersion cooling solutions are becoming critical to managing the heat loads in modern data centers.

As EV adoption grows, stakeholders across automotive, energy, and technology sectors are in search of detailed insights to shape their strategies and investments.

Semiconductor manufacturing processes require many chemicals and specialty gases. Owing to its cryogenic properties, exceptional thermal conductivity, chemical inertness, and high diffusivity, helium is used throughout the semiconductor manufacturing line, particularly for wafer cooling where there are no viable alternatives.

Tuesday 24 September 2024 - How Chronic Supply Challenges Are Reshaping Helium Use in Key Industries. An overview of global helium production and supply; Impact of supply challenges on different industries e.g. semiconductors and fiber optics manufacturing, cryogenics, and several others; Technological advances to reduce helium consumption (e.g. MRI and NMR); Trends in the adoption of substitutes or reclamation systems; Outlook for global helium production capacity and demand