Thermal Management

Proper selection of thermal interface materials is crucial for the efficiency of electronic devices, has been proven to reduce the cost of ownership, reduce system power consumption and increase operational lifetime.

Everyone wants portable products. Miniature high density circuits, often housed in airtight enclosures are required, so we can use our devices everywhere, including in wearable technologies. Heat management is therefore a big problem, particularly as the trend of consumers demanding smaller, faster operating electronics continues.

Overheating is the most critical issue in the computer industry.

New research conducted by IDTechEx finds that the thermal interface materials market - including tapes, adhesives, greases, gels, pastes, elastomeric pads, phase change materials, graphite, solders, compressible materials and liquid metals - will grow from $1.7 billion in 2015 to $3.7 billion in 2025.

The Japanese are working very hard on thermoelectric energy harvesting from tiny forms for use on hot running electronics components the 1.5 kW versions for use on furnace flues etc.