Transparent Conductive Films

IDTechEx will be hosting a free webinar on Tuesday 5 June titled Transparent conductive films and materials: Major trends shaping the industry's past, present and future.

As Ready Player One is released in cinemas around the world, IDTechEx are also releasing their latest market research report after four years covering the haptics industry.

In Mold Electronics is making a commercial comeback. The behind-the-scenes interest in IME remains robust. The first wave of products are close to market launch, the value networks are being enhanced, volume manufacturers are more engaged than ever, and the material set is transitioning beyond conductive inks to include transparent conductive films, sensors, actuators, and so on. Overall, we expect 2017/18 to the years when IME applications finally grow after years of on and off starts.

The transparent conductive film (TCF) industry will leave behind its years of sluggish growth to achieve rapid growth.

The transparent conductive film (TCF) industry has witnessed upheaval in recent years.

IDTechEx Research has been closely following the ITO alternative market for the past five years. It forecasts that ITO alternative solutions will reach more than $250m by 2026. In this article, IDTechEx Research brings you an update on conductive ink-based metal mesh films.

Last year IDTechEx Research asserted that the transparent conductive film industry had entered a period of intense consolidation. We have been proved right as the consolidation period is beginning to take its first round of high profile victims.

Transparent conductive sheets (on glass or other substrates) are used in a variety of applications including touch screens, displays, lighting, photovoltaics, etc.

This article introduces some of the research and content of the new IDTechEx report "Transparent Conductive Films (TCF) 2014-2024: Forecasts, Technologies, Players."

As more and more companies are gearing up and demonstrating flexible display prototypes the need for protection of these new devices that are freed from the constraints of conventional rigid form factors is highlighted once more.