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Advanced Materials World
Posted on October 2, 2025 by  & 

Heat Transfer, Gap Pads, and TIM Benchmarking with IDTechEx

Consumer electronics are pictured on a table next to thermal interface materials.
Thermal interface materials (TIMs) are responsible for transferring the heat from heat generating components onto a heatsink in electronic devices, including electric vehicle batteries, and consumer electronics, to ensure safety is optimized and that overheating does not occur. IDTechEx's report, "Thermal Interface Materials 2026-2036: Technologies, Markets and Forecasts", covers the rapidly growing market for these materials, along with forecasts for their uptake over the next decade.
 
Benchmarking and material comparisons
 
Gap pads are a thermal interface material described as being excellent in three of IDTechEx's benchmarking categories, which include bulk thermal conductivity, application precision, and reworkability, while only performing 'fairly' in low interfacial resistance and longevity categories. Phase change materials are displayed in IDTechEx's report as being the most promising TIM across all nine benchmarks, which also include low bond line thickness, ease of manufacturing, and good contact. However, it is worth noting that these comparisons are all relative, and it depends on the context.
 
Thermal grease is one of the most commonly used TIMs. However, the specific design requirements of any given application will determine which TIM is best suited, with some material capabilities taking priority over others. Thermal grease is capable of getting rid of air gaps and filling surface inconsistencies, which can reduce thermal resistance and overall performance.
 
 
Thermal pads have a desirable 'ease of use' factor, as they can be cut easily to fit an application, coming in varying thicknesses, and can be more easily handled than other material types, requiring less precision. They are also favored for their durability in humid and harsh environments, though may be susceptible to mechanical stress and delamination, highlighting potential drawbacks to any material, where pros and cons will need to be weighed on a case-by-case basis.
 
Alumina, graphene, and carbon nanotubes as TIM fillers
 
Commonly used TIM fillers include alumina, magnesium oxide, zinc oxide, graphene, and carbon nanotubes. IDTechEx's report also provides extensive research into the benefits and drawbacks of each of these materials. Alumina specifically has an extremely high melting point of over 2000 degrees Celsius, while also being chemically inert, and can be sourced at very low costs compared to alternatives. However, one of alumina's main drawbacks is its low thermal conductivity, which could be an issue in some applications.
 
Graphene, unlike alumina, has high thermal conductivity, efficient heat and electricity transfer, and exceptionally high strength. Carbon nanotubes have even greater thermal conductivity as a result of their strong carbon to carbon bonds, and high electrical conductivity, which could hinder them in more sensitive applications. Graphene and carbon nanotubes, however, come at high costs, which could potentially limit their uptake. IDTechEx's reports, "Graphene & 2D Materials 2026-2036: Technologies, Markets, Players" and "Carbon Nanotubes 2025-2035: Market, Technology & Players", cover these materials and their wider applications in greater depth.
 
 
TIM applications and IDTechEx's wider thermal management portfolios
 
Alongside electric vehicle batteries and consumer electronics such as smartphones and laptops, data centers, advanced driver-assistance systems (ADAS), and 5G base stations are also outlined in IDTechEx's report as being amongst the main applications for TIMs. IDTechEx also describes in their report the growing need for advanced TIMs, which boast even higher thermal conductivity and can be better tailored to suit certain application sectors. IDTechEx's report, "Thermal Management for Electric Vehicles 2026-2036: Materials, Markets, and Technologies", covers the most suitable thermal management for specific applications within the EV market, while "Thermal Management for Data Centers 2025-2035: Technologies, Markets, and Opportunities" provides extensive research into the data center market.
 
Silicon-free TIMs are up and coming as a means to evading potential problems with outgassing, creeping, and surface contamination. The development of these materials may also allow for the potential withstanding of a wider variety of temperatures, which could benefit military and aerospace applications specifically, where much higher temperatures are generated.
 
 
For more information, visit IDTechEx's report, "Thermal Interface Materials 2026-2036: Technologies, Markets and Forecasts", and the wider portfolio of Thermal Management Research Reports.

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Posted on: October 2, 2025

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