Quantum computers have the potential to tackle problems it would take classical computers trillions of years to solve. Most quantum computer designs depend on cooling the hardware to extreme temperatures well below -200 degrees Celsius.

Thursday 17 August 2023 - An introduction to FHE, including motivating factors; Discussion of recent innovations and commercial developments within FHE; Identification of technological gaps and potential solutions; A roadmap for how the industry will develop, spanning both technologies and applications.

Can electronics be additively manufactured and flexible without compromising on the capabilities of conventionally produced integrated circuits (ICs)? Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) offers an enticing blend of capabilities, enabling rapid prototyping, flexibility/stretchability, and roll-to-roll manufacturing of circuits with conventional ICs.

Thursday 3 August 2023 - Materials and Processing Trends for 2.5D and 3D Semiconductor Packaging; An overview of advanced semiconductor packaging technology: landscape and development; Manufacturing methods and dielectric materials choice for 2.5D packaging; A review of 3D Cu-Cu bonding packaging technology: materials and manufacturing processes barriers and future trend

Li-ion batteries are widely used in various markets, such as in consumer electronics, electric vehicles (EVs) and stationary energy storage. However, as demand for Li-ion batteries continues to increase, the need to manage their sustainability through their entire lifecycle, including at end-of-life (EOL), is also becoming increasingly important.

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Thursday 27 July 2023 - Surging Demand for Lithium-Ion Batteries Driving the Carbon Nanotube Market. 10-year market outlook for CNTs; Analysis of CNT usage in the energy storage industry, including technology trends in LiBs and next generation batteries; Overview of other key applications; Discussion of key players and supply chain pain points; Emerging technologies incl. green feedstock

The energy storage market is booming, driven predominantly by the electrification of the transportation sector. With the increasing demand for lithium-ion batteries (LiB), significant attention has been given to the supply chain of materials for LiBs beyond lithium itself. Carbon nanotubes (CNTs) are gaining traction as a conductive additive at the cathode of LiBs, paving the way for significant expansion in the CNT market.

For many decades there has been an extensive amount of materials science R&D focussed on developing next-generation gas separation membranes. However, to date, the market is still dominated by those polymeric materials that initially gained commercial adoption in the late 20th century.

This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging.

Thursday 6 July 2023 - Drivers and constraints of Li-ion battery recycling; Value chain and economics of Li-ion battery recycling; Policies and regulation overview in different regions; Technologies used in this market, including hydrometallurgy, pyrometallurgy and direct recycling; Introduction to market analysis and future global recycling facility expansions

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

Wednesday 28 June - Where Metamaterials Meet Tele-Communications. What is a reconfigurable intelligent surface (RIS), and why are they likely to be needed for high frequency telecommunications.; The different types of RIS (passive, semi-passive, active) and where they are likely to be deployed; Manufacturing processes and materials required for RIS production.

Li-ion batteries dominate the electric vehicles (EV), consumer electronics and stationary energy storage markets. However, the sustainability of these batteries through their entire lifecycle must be managed, including at End-of-Life (EOL). IDTechEx's new report, "Li-ion Battery Recycling Market 2023-2043", finds that an estimated 23.8 million tonnes of lithium-ion batteries will be recycled in 2043.

Thursday 22 June 2023 - Gas Separation Membranes: Decarbonization Driving New Market Opportunities. Overview of the technical advantages, history, and limitations of gas separation membranes; Technology appraisal of incumbent and emerging membrane materials; Market analysis of the emerging application areas including biogas upgrading, carbon capture, and the hydrogen infrastructure; For each market, a comparison against alternative separation techniques (e.g., PSA or cryogenic) and discussion on pain points and technical requirements; Independent outlook and technology roadmap for the commercial penetration of membranes in the fields of energy and decarbonization

Decarbonization is the main market driver across the industrial sector. In every roadmap there is an evolving mix of solutions that span the technology readiness spectrum, each with their own proponents and critics.

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

Thermal runaway and the associated battery fires have proven to be a critical concern for customers, battery designers, and electric vehicle manufacturers. Many vehicles have experienced battery fires and hundreds of thousands have been recalled.

Thermal Interface Materials (TIMs) come in different forms, including thermal pads, thermal grease, gap fillers, thermal paste, and thermal gels. Thermal gel and thermal paste, two of the most commonly used forms, have gained significant momentum over the past several years, especially in the EV, data center, and 5G industries.