Thermal Management

By 2035, IDTechEx forecasts that the continued growth of artificial intelligence will result in over 2000 TWh of energy being consumed by data centers. The expected increase in CO2 emissions from powering these new data centers creates a dual challenge for both governments with net-zero targets and tech giants with internal carbon neutrality pledges alike: how can the unprecedented rise of AI be supported without causing major harm to the environment?

The use of graphics processing units (GPUs) within high performance computing (HPC) has been increasingly adopted since the introduction of generative AI and large language models, as well as advanced memory, storage, networking, and cooling technologies. A major catalyst for growth has been the integration of AI into HPC workflows, where a convergence of the two unlocks opportunities in various fields by combining the powerful computational power of HPC with the intelligent data processing and "decision-making" of artificial intelligence.

The HPC hardware market is set for enormous growth driven by the ongoing AI boom, with a market value exceeding half a trillion dollars predicted by 2035. HPC has long been an integral tool across critical industries, from facilitating engineering modeling to predicting the weather. AI has intensified development in the sector, growing the capabilities of hardware technologies, including accelerators, interconnects, and memory, at astounding rates.

This article discusses the changes in battery pack design that impact which cell chemistries can be used in a commercially viable way. An overview is given for future adoption of new cell chemistries such as LMFP and solid state batteries, and how pack structure will impact their applicability.

The data center cooling value chain is long, complicated, and chaotic, consisting of multiple stakeholders. Data center cooling happens on multiple levels including chip and server level, as well as the rack and facility level.

Air cooling dominated the battery cooling market a few years ago but was overtaken by active cooling (using indirect liquid cooling methods) due to its ability to keep the cells at a more optimal temperature range, enabling greater battery longevity and faster charging. According to IDTechEx, this method is expected to be just as popular over the next decade, with trends predicted to be similar except for a small increase in immersion for niche applications.

A power module in DC fast chargers is a critical component that converts AC grid power into high-voltage DC power to charge EV batteries efficiently. It integrates rectifiers, inverters, and control systems to ensure precise power delivery while optimizing energy efficiency and minimizing heat loss. Power modules are essential for achieving rapid charging speeds and supporting high-power applications, meeting the demands of growing EV adoption.

IDTechEx predicts that GPUs with a TDP of over 1500W could be expected over the next year in 2025, with the management of energy costs becoming slightly trickier. Thermal management and cooling systems will therefore need to become a main consideration in data center designs to enable efficient cooling, enhanced thermal efficiency, and reduced energy waste.

Utilizing alternatives to helium where possible could allow for a greater conservation of helium, which could prove to be necessary for the market going forward. IDTechEx reports that since 2005, there have been 4 supply shortages of helium, each resulting in high price volatility, with the price of helium having almost doubled since 2021.

In this article, IDTechEx will summarize the main trends of thermal management in the data center and EV power electronics industries, as well as the recent developments of thermal interface materials used.