Advanced Materials

Thermal management for EV power electronics has long posed significant challenges. The ongoing shift from Si IGBT and SiC MOSFET to potentially GaN HEMT in the future results in higher junction temperatures and increased demand for die-attach materials in EV power modules. In traditional Si IGBT power modules, die-attach materials like Pb95Sn5 and Pb92.5Sn5Ag2.5 struggle to meet reliability requirements for packaging power devices in high-temperature applications due to creep-fatigue concerns.

With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly useful for human-machine interfaces (HMIs).

Thursday 13 June 2024 - Chemical Recycling: Navigating the Landscape of Innovative Technologies and Scaling Challenges; An overview of chemical recycling of plastic technologies; Challenges to adoption and scaling; The challenges faced by enzymatic depolymerization; Chain of custody approaches; IDTechEx's outlook and conclusions

Metamaterials use regular engineered patterns of subwavelength structures to interact with waves. Electromagnetic metamaterials promise to have transformative effects within the fields of optics and telecommunications. They could make biometric recognition cheaper and more accurate, make virtual reality more immersive and comfortable, and facilitate high-speed mobile internet with zero signal blackspots, yet adoption is in its infancy.

Thermal interface materials (TIMs) are increasingly adopted, with the market size expected to exceed US$8 billion by 2034. Thermal fillers play a crucial role in TIMs as they directly affect properties such as thermal conductivity, viscosity, cost, abrasiveness, and several other factors.

According to IEA's 2023 update to its net zero roadmap, carbon capture technologies, more efficient space cooling equipment, and clean energy transitions are all cornerstones of achieving net zero by 2050 and limiting global warming to 1.5°C. Emerging technologies utilizing metal-organic framework (MOF) materials for carbon capture, refrigerant reclamation, direct lithium extraction, HVAC equipment, and various other chemical separations and purification processes can see the advent of disruptive next-generation technologies that are essential for industrial decarbonization.

The risk of missing out on the competitive advantage quantum computing offers is rising. Governments and private investors worldwide are placing multi-billion-dollar bets that the industry will produce huge long-term returns. Yet, for this to be realized, the theoretical advantage of quantum computers must be translated into real-world commercial value. In this article, IDTechEx explores which applications are being developed today across the materials, chemical, automotive, finance, and healthcare industries.

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Previously, antennas were positioned on PCBs; now, there's a shift towards integrating antennas directly onto the same package as the RF chip.

IDTechEx, a trusted provider of independent market intelligence, have released a new market report, "Thermal Interface Materials 2024-2034: Technologies, Markets, and Forecasts". The report forecasts the global TIM market size will reach around US$7bn by 2034.

In a world where fossil fuels are increasingly being avoided, and the mounting problem of plastic waste management intensifies, a new approach to plastic waste has attracted much attention. Advanced recycling technologies such as chemical recycling and the dissolution of plastic waste aim to increase the circularity of the plastics economy.