Advanced Materials

Although graphene and carbon nanotubes have long been touted as "wonder materials" with the potential to address numerous global challenges, the initial excitement did not quickly lead to widespread commercial success. IDTechEx has closely monitored the nanocarbon market for over ten years, and this article will evaluate the application areas where graphene and CNTs are likely to achieve notable success in the next ten years.

As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density. Chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing.

Concerns over incumbent strategies for PFAS waste management have created opportunities for novel PFAS destruction technologies to potentially disrupt the status quo. Universities and independent start-ups are developing numerous different destruction technologies.

SAF has emerged as a crucial decarbonization tool offering up to 80% emissions reduction while being drop-in compatible with existing aircraft engines and infrastructure. This article discusses the key SAF production technologies and market drivers.

The growing awareness of the negative effects of chemicals and materials we've built our modern society on has led governments, companies, academics, and consumers alike to search for alternatives. This will no doubt be a monumental task. In many places, there are no suitable replacements. Still, significant activity is taking place worldwide, which IDTechEx has followed in our research, to push different sectors to identify chemicals and materials for a less contaminated, more circular world.

On Tuesday, November 5th, millions of Americans went to the polls to vote for the 47th President of the United States. The results were emphatic: a second Trump administration and a Republican-controlled Senate. While this election will impact many aspects of the global economy, what do these results entail for one of the world's biggest automotive markets?

Hydrogen and its derivatives (e.g. ammonia, methanol) will be crucial in decarbonizing diverse sectors and serving as energy carriers for global renewable energy transport. As a result, the market is seeing increased commercial interest from technology providers, engineering services, and project developers eager to capitalize on this expanding opportunity.

The evolution of telecommunications continues with each decade, and as 5G becomes widespread, attention is shifting to the next generation: 6G. Promising next-level capabilities compared to next generation, 6G will offer data rates reaching terabits per second (Tbps), microsecond-level latency, and ultra-high level of network reliability.

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex.

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.