Advanced Materials

Utilizing alternatives to helium where possible could allow for a greater conservation of helium, which could prove to be necessary for the market going forward. IDTechEx reports that since 2005, there have been 4 supply shortages of helium, each resulting in high price volatility, with the price of helium having almost doubled since 2021.

As the world grapples with the environmental impact of traditional plastics, bioplastics derived from carbon dioxide (CO2) and waste materials present a promising solution. This emerging sustainable market seeks to address two critical global challenges: reducing greenhouse gas emissions and managing waste.

Monday 2 December 2024 - Background on the hydrogen value chain, from production to end-use applications; Significant developments in low-carbon hydrogen production, storage, distribution, and industrial applications in late 2023 and 2024; Overview of various fuel cell technologies; Major trends for fuel cells in automotive and stationary power markets; Market outlook

Although graphene and carbon nanotubes have long been touted as "wonder materials" with the potential to address numerous global challenges, the initial excitement did not quickly lead to widespread commercial success. IDTechEx has closely monitored the nanocarbon market for over ten years, and this article will evaluate the application areas where graphene and CNTs are likely to achieve notable success in the next ten years.

As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density. Chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing.

Concerns over incumbent strategies for PFAS waste management have created opportunities for novel PFAS destruction technologies to potentially disrupt the status quo. Universities and independent start-ups are developing numerous different destruction technologies.

On Tuesday, November 5th, millions of Americans went to the polls to vote for the 47th President of the United States. The results were emphatic: a second Trump administration and a Republican-controlled Senate. While this election will impact many aspects of the global economy, what do these results entail for one of the world's biggest automotive markets?

The evolution of telecommunications continues with each decade, and as 5G becomes widespread, attention is shifting to the next generation: 6G. Promising next-level capabilities compared to next generation, 6G will offer data rates reaching terabits per second (Tbps), microsecond-level latency, and ultra-high level of network reliability.

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex.

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.