Thermal Management

This new report, "Thermal Management For Data Centers 2026-2036: Technologies, Markets, and Opportunities", covers in-depth technical analysis of different cooling technologies for data centers, including air cooling, single-phase direct-to-chip cooling, two-phase direct-to-chip cooling, single-phase immersion, two-phase immersion, and microfluidic cooling.

Thermal interface materials are responsible for transferring the heat from heat generating components onto a heatsink in electronic devices. This article covers IDTechEx's benchmarking of some of the most common materials, and the main applications for TIMs.

A data center fire has caused the shutdown of hundreds of online government services in South Korea, likely caused by a battery explosion. This incident is particularly severe, but there have been many like it through the battery energy storage system (BESS) industry, highlighting the need for further improvements to enhance battery safety.

Incidents such as a suspected battery explosion resulting in the recent fire at South Korea's national data center halting major online government services, bring to the fore the need to minimize the risk of thermal runaway events.

The need for thermal protection systems for spacecraft is currently a hot topic a result of recent growth within the space tech industry. This article covers the shift from governmental to commercial expeditions, and explores different types and approaches to thermal management.

Join IDTechEx Senior Technology Analyst Yulin Wang on Thursday 2nd October for 'Thermal Interface Materials: TIM1, TIM1.5, TIM2 - 3.2x market size increase from 2025 to 2036', a webinar that will dive deep into the evolving world of TIMs, exploring how these materials are shaping the future of thermal management across diverse applications. Choose your preferred time zone - the webinar runs three times during the day.

As semiconductor packaging surges toward 2.5D and 3D architectures, managing thermal resistance at the interface becomes mission-critical. With traditional thermal interface materials (TIMs) no longer sufficient, the next generation of TIMs offers the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. The market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036.

Watch this short IDTechEx video to learn about refrigerant trends, emerging material solutions and car refrigerant demand through to 2036.

This article discusses some of the potential applications of advanced coatings technologies. Coatings are a vital tool in a multitude of industries globally. Find out more in IDTechEx's latest report, 'Advanced Coatings 2026-2036: Market, Technologies, Players'.

This article, drawing from IDTechEx's report on Thermal Management for Electric Vehicles 2026-2036 takes a deep dive into the thermal management related materials and components in an EV, along with analysis on key trends and players for each.