Advanced Materials

The evolution of telecommunications continues with each decade, and as 5G becomes widespread, attention is shifting to the next generation: 6G. Promising next-level capabilities compared to next generation, 6G will offer data rates reaching terabits per second (Tbps), microsecond-level latency, and ultra-high level of network reliability.

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing these technologies to meet high performance and yield standards while fulfilling client requirements is complex.

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

Thursday 7 November 2024 - Which Technology Innovations Will Be Most Disruptive in the Global Sensor Market? An overview of meta-trends shaping the sensor market landscape; A summary of major market verticals, product types and leading technologies; Coverage of near-term trends in sensor technology development, adoption and integration - including the impact of AI on edge sensing; An overview of disruptive emerging sensor technologies recently commercialized, their value proposition, advantages and market challenges. This includes printed sensors, quantum sensors, emerging image sensors, biosensors, gas sensors and nanocarbon sensors; Case studies in fast growing markets for sensors technology, both established and emerging, such as future mobility, wearables and IoT (industrial, consumer and environmental); Initial ten-year forecasting insights and sensor market outlook for the next ten years

Thursday 14 November 2024 - Chiplet Technology: Revolutionizing Semiconductor Design and Integration; Definition and significance of chiplets in modern semiconductor design; Comparison with SoC and SiP technologies; Introduction to heterogeneous integration; Drivers and advantages of adopting chiplet technology; Brief overview of challenges in implementing chiplets; Insights into the future potential and impact of chiplet technology

Monday 25 November 2024 - Navigating The Momentum Pushing the Per- And Polyfluoroalkyl Substances (PFAS) Treatment Market to US$2.3 billion by 2035. Regulatory trends and standards from key regions such as the US, the EU, and Asia-Pacific, highlighting differences in regulations and their implications for PFAS treatment markets; The incumbent and emerging PFAS treatment technology landscape: granular activated carbon, ion exchange resins, foam fractionation, etc; Introduction to PFAS destruction and relevant technologies; Key players in PFAS removal and destruction technologies

While sensors contribute just a fraction of the annual revenue generated by major electronics companies, sensor technology nevertheless represents a multi-billion-dollar global market.

The electrification of vehicle fleets globally continues to create demand for rare earth magnets. With China being the largest electric vehicle market, rare earth permanent magnet motors are expected to retain the majority of the electric motor market share.

Given helium's critical role in semiconductor production, onshoring chip manufacturing will have a significant knock-on impact on the helium demand for semiconductor manufacturing.

While most of the voluntary market saw a downturn in 2023, corners of the market selling durable, carbon removal credits are flourishing and playing a vital role in supporting emerging technologies such as direct air capture and CO2 utilization in concrete.