Thermal Management

As of 2025, single-phase direct-to-chip (D2C) cooling remains the dominant solution for high-end GPU thermal management. However, as thermal design power (TDP) continues to climb, two-phase D2C cooling is expected to become essential, with large-scale adoption projected around 2026-2027.

With the growing scrutiny of Li-ion battery energy storage system (BESS) safety, demand for passive materials and active technologies is set to grow. BESS developers are all adopting different strategies to ensure that their systems can strike the right balance of safety against overall system cost.

This webinar on Tuesday 25th November, presented by IDTechEx Senior Technology Analyst Conrad Nichols, will discuss thermal management and fire prevention trends for battery energy storage systems (BESS). Choose your preferred time zone - the webinar runs three times during the day.

Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. The choice of thermal filler materials, geometries, and loading percentages can greatly impact not only the thermal properties of TIMs but also other aspects such as cost, dielectric strength, compressibility, and viscosity. This article shares more about some common thermal fillers, pros and cons of different fillers, and market trends,.

Graphene has been discussed as a wonder material that will unlock the next-generation technologies seen in sci-fi movies. This article explores why these advances have not been seen, the tangible success that graphene has shown in consumer electronics and a look to the potential role of graphene in the next iteration of batteries.

Thermal management technologies are an integral part of systems within a number of sectors, ensuring optimized performance and safety. This article covers some of the thermal management techniques used in data centers and semiconductors.

Thermal runaway in lithium-ion (Li-ion) batteries has become one of the most pressing challenges for the global battery energy storage system (BESS) industry.

As of 2025, single-phase direct-to-chip (D2C) liquid cooling remains the dominant solution for high-end GPU thermal management. However, with thermal design power (TDP) continuing to rise, the industry is approaching the limits of what single-phase cooling can handle. Two-phase D2C cooling is expected to enter large-scale deployment around 2027.

The increase in demand for high performance computing is resulting in the need for enhanced semiconductor performance, of which thermal management is a large component. This article covers some of the latest developments and favored materials involved in thermal management for advanced semiconductor packaging.

Join IDTechEx Technology Analyst Thomas Bithell on Thursday 16th October for 'Coating Solutions Providing Advanced Corrosion Protection', an insightful webinar on innovation in anticorrosion coatings. Choose your preferred time zone - the webinar runs three times during the day.